Researchers from Nagoya University, Japan, have proposed a patterned structure of push-together gold nanowire arrays dubbed “surface fasteners” that enable cold bonding of surface mount technology (SMT). The technique represents a low-temperature alternative to reflow soldering, which could avoid thermal damage of components and help make circuits much easier to disassemble and recycle at the end of their lifetime (…)
via Metallic nanowire surface fasteners provide alternative to soldering – nanotechweb.org.