Posted Date: 01/14/2011
Uyemura International Corp., world leader in high-performing plating processes, has announced an important new technology that prevents whisker formation in electroplated tin for 22,000 hours – and longer.
To be marketed under its beta test name, GHS-51, this unique high speed electrolytic process represents a breakthrough in the control of tin whiskers. Whisker crystals of tin and tin-based alloys are the most common culprits in the short circuiting of electronic components. Most often, the cause of tin whisker formation is compressive stress. The proprietary technology developed by Uyemura dissipates compressive stress, preventing whisker formation.GHS-51 uses a high purity anode, and is ideally suited for connectors and semiconductor lead frames. It offers high deposition speeds for rackless and reel-to-reel
Source : American Fastener Journal – Read full article in the news section via American Fastener Journal.