Master Bond EP3HTSDA-1 is a single part, no-mix epoxy adhesive designed primarily for die attach applications. It exhibits a die shear strength of 20 – 22kg-f and has a high thermal conductivity of over 40 – 45BTU•in/ft2•hr•°F [5.7 – 6.5W/m•K]. “This 100% solids formulation has an ideal viscosity and flow for die attach, will not ‘tail’ and can be easily dispensed automatically” says Rohit Ramnath, senior product engineer. “Additionally, it has an unlimited working life at room temperature and will cure in 20 – 30 minutes at 250°F or 5 – 10 minutes at 300°F.”(…)
via Electrically conductive die attach adhesive | Fastener + Fixing Technology.